MEMORIA DDR4 8GB MARKVISION 3200MHZ 1.35V BULK

MEMORIA DDR4 8GB MARKVISION 3200MHZ 1.35V BULK

MARKVISION
K8GBD4-3200

288-pin, small-outline dual in-line memory module (LODIMM)

Fast data transfer rates:

8 GB (1024Meg x 64)

VDD = 1.35V

VPP = 2.5V (typical)

VDDSPD = 2.2–3.6V

Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

Low-power auto self refresh (LPASR)

Data bus inversion (DBI) for data bus

On-die VREFDQgeneration and calibration

Dual-rank

On-board serial presence-detect (SPD) EEPROM

16 internal banks; 4 groups of 4 banks each

Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)

Selectable BC4 or BL8 on-the-fly (OTF)

Gold edge contacts

Halogen-free

Fly-by topology

Operating temperatura Commercial (0°C = TOPER = +85°C)

Package 288-pin DIMM (halogen-free)

Frequency/CAS latency X X

Density Organization JEDEC speed bin Package

8GB 1024M × 8 3200MHz (16-18-18-39)

288 pin LO-DIMM

3200MHz @ CL=16

MARKVISION
288-pin, small-outline dual in-line memory module (LODIMM)

Fast data transfer rates:

8 GB (1024Meg x 64)

VDD = 1.35V

VPP = 2.5V (typical)

VDDSPD = 2.2–3.6V

Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals

Low-power auto self refresh (LPASR)

Data bus inversion (DBI) for data bus

On-die VREFDQgeneration and calibration

Dual-rank

On-board serial presence-detect (SPD) EEPROM

16 internal banks; 4 groups of 4 banks each

Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)

Selectable BC4 or BL8 on-the-fly (OTF)

Gold edge contacts

Halogen-free

Fly-by topology

Operating temperatura Commercial (0°C = TOPER = +85°C)

Package 288-pin DIMM (halogen-free)

Frequency/CAS latency X X

Density Organization JEDEC speed bin Package

8GB 1024M × 8 3200MHz (16-18-18-39)

288 pin LO-DIMM

3200MHz @ CL=16